新 半导体多芯片堆叠大尺寸封装基板产 品制造项目厂房建设项目施工总承包-半导体多芯片堆叠大尺寸封装基板产品制造项目厂房建设项目_半导体多芯片堆叠大尺寸封装基板产品制造项目厂房建设项目施工总承包招标公告 工程建设 | 房屋建筑 招标公告、资格预审公告 广交易数字交易平台 发布时间：2025-11-29 (Tender №133234787)

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